Tungsten Copper Plates for Heat Dissipation and Semiconductor Applications
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Tungsten copper plates are advanced composite materials designed for thermal management systems.
They combine tungsten’s high-temperature resistance with copper’s excellent heat conductivity.
Manufactured through powder metallurgy and infiltration processes, they ensure high density and stability.
These plates are widely used in semiconductor packaging, heat sinks, and aerospace thermal systems.
They provide excellent dimensional stability and thermal shock resistance.
Ideal for high-power electronic and precision industrial applications.
Description
Common Grades & Specifications
| Grade | Cu% | Application |
| W60/Cu40 | 40% | Heat sink systems |
| W70/Cu30 | 30% | Electronics |
| W80/Cu20 | 20% | Aerospace |
Product Forms
| Form | Size |
| Plate | 1–50 mm thickness |
Physical Properties
| Density | 12–17 g/cm³ |
| Thermal Conductivity | 160–220 W/m·K |
Common Grades & Specifications
Buyers choose the grade based on conductivity vs heat resistance requirements.
| Grade | Copper % | Tungsten % | ASTM B702 | RWMA Class | Application |
| W50/Cu50 | 48–52% | Balance | Class A | — | Light-duty electrical contacts |
| W60/Cu40 | 38–42% | Balance | Class B | — | General EDM electrodes |
| W70/Cu30 | 28–32% | Balance | Class C | Class 10 | High-voltage switchgear |
| W75/Cu25 | 23–27% | Balance | Class D | Class 11 | Heavy-duty EDM & welding |
| W80/Cu20 | 18–22% | Balance | Class E | Class 12 | Heat sinks & aerospace nozzles |
| W90/Cu10 | 8–12% | Balance | — | — | Specialized thermal mounting |
Available Product Forms & Dimensions
Tungsten copper is not cast. It is produced in semi-finished forms for precision machining.
| Product Form | Diameter / Thickness | Length / Size | Finish |
| Round Rod | 1–100 mm | 100–1000 mm | Ground / Polished |
| Square / Hex Bar | 5–80 mm | 200–500 mm | Machined |
| Plate / Sheet | 1–50 mm | 100×200 to 300×300 mm | Rolled / Ground |
| Foil / Strip | 0.05–0.5 mm | Custom | Bright / Matte |
| Finished Parts | Per drawing | Per drawing | CNC / EDM |
Physical Properties
| Grade | Density (g/cm³) | Hardness (HB) | Conductivity (% IACS) |
| W60/Cu40 | ~12.75 | 140 | 47% |
| W70/Cu30 | ~14.18 | 175 | 42% |
| W75/Cu25 | ~14.50 | 195 | 38% |
| W80/Cu20 | ~15.15 | 220 | 34% |
| W90/Cu10 | ~16.75 | 260 | 27% |
Video
Literature
Reliable Tungsten Copper Plates for Heat Dissipation and Semiconductor Applications Manufacturer & Supplier in China
Robust provides high-quality Tungsten Copper Plates for Heat Dissipation and Semiconductor Applications solutions for industrial, high-temperature, and precision engineering applications worldwide.
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